Improving safety and consumer experiences highlight Emerson’s presence at North America’s largest packaging expo
Chicago (October 1, 2016) – Emerson’s packaging capabilities will be on display as industry leaders converge on Chicago’s McCormick Place for PACK EXPO International 2016 Nov. 6-9.
The four-day event will see more than 2,300 exhibitors and 50,000 attendees according to The Association for Packaging and Processing Technologies (PMMI) – the event’s producer.
Emerson, located at PACK EXPO in the Upper North Hall – Booth #N-5447, will provide expertise and technologies throughout the packaging design and production to help minimize downtime, improve efficiency, reduce energy and save material for maximum efficiency and product quality. Products from trusted Emerson brands ASCO, Branson Ultrasonics, Cascade and SolaHD will demonstrate fit-for-purpose solutions such as G3 Fieldbus, ultrasonic welding, reliable power and leak detection technology in addition to a Vertical Form Fill Seal machine, fit with many of Emerson’s latest offerings.
Two of Emerson’s experts will present on PMMI’s Innovation Stage during PACK EXPO International 2016. Located in McCormick Place’s North Upper Building, the Innovation Stage features free education programming presented by packaging industry leaders and subject matter experts to address attendees’ most top-of-mind issues and trends.
Enrico De Carolis, vice president of global technology for ASCO Numatics at Emerson, will present “Protect Your Workers and Operation: Zoned Machinery Safety in Pneumatic Applications” at 1 pm on Nov. 7. De Carolis will show how zoned safety uniquely enables greater productivity and safety in machines without compromising productivity and availability.
Hans Neisser, senior applications engineer for Branson Ultrasonics at Emerson, will follow at noon on Nov. 8 with “Creating a Positive Consumer Experience: How to Leverage the Benefits of Ultrasonic Technology in Packaging.” Neisser will illustrate why so many CPGs and OEMs are turning to ultrasonic technology – a green thermoplastic welding technique that quickly and reliably seals through contaminants, reduces failures, minimizes waste and saves energy.
Amazing Packaging Race
For the sixth-consecutive year, engineering students from colleges around the United States will be competing in the Amazing Packaging Race, presented by Emerson’s ASCO brand. Organized by PMMI and co-sponsored with the show, participants will team together and race to exhibitor booths to compete in hands-on, packaging engineering challenges and win prizes.
The contest encourages teachable moments such as teamwork and creates a positive networking opportunity. Participants also gain valuable knowledge while completing the challenges and speaking with industry professionals on site.
To learn more about Emerson’s presence at PACK EXPO International 2016, please visit Emerson’s exhibitor detail page.